Trade fair accommodation
Hotel accommodation for exhibitors, visitors and business teams attending ISM 2027.
ISM Snacks & Sweets takes place from 31 January to 3 February 2027 at Koelnmesse, Fair Grounds, Köln-Deutz, in Cologne, Germany. The trade fair focuses on the snacks and sweets industry and covers international trade, the value chain, innovation, and sustainable production.
Product areas include chocolate and chocolate products, sugar confectionery, biscuits, snack foods, trend snacks and natural sweets, breakfast snacks, ice cream, and frozen confectionery. The event is intended for manufacturers, retailers, and supply-industry companies from relevant international markets.
Professional visitors include retailers, foodservice suppliers, confectionery traders, bakeries, wholesalers, online food retailers, nutrition scientists, food chemists, and manufacturers. This makes ISM Snacks & Sweets relevant to professionals involved in product development, sourcing, retail, foodservice supply, manufacturing, and the wider confectionery and snack value chain.
Visitors, exhibitors, and business teams can submit an accommodation request through Exibre for their stay in Cologne.
Stay for this exhibition
Selected accommodation for visitors and exhibitors attending this event.
Personal request
Whether you need one room or accommodation for an entire exhibition team, tell us your requirements and we’ll help find suitable options.
Trade-fair focused
Event dates carried into hotel selection
Corporate and group support
Personal assistance
Helpful information
Available hotel options are shown on this page. Select a hotel to view its rooms and the details for your stay.
Yes. You can adjust the dates, guests and number of rooms during the hotel and room selection process. The displayed options and price may update.
Yes. Use the accommodation request form to provide your event, dates, room quantities and team requirements.
Send an accommodation request with your requirements and the Exibre team will contact you about the next steps.